doi:10.1109/DTIP.2016.7514895engBerenschot, J.W.Tiggelaar, R. M.Geerlings, J.Gardeniers, J.G.E.Tas, N.R.Malankowska, M.Pina, M.P.Mallada, R.3D-Fractal engineering based on oxide-only corner lithographyART-2016-125584This paper reports a new highly simplified machining process for three dimensional (3D)-fractal nanofabrication based on oxide-only corner lithography. It consists of a repeated sequence of wet etching (silicon), thermal oxidation and wet etching (silicon oxide). The previously reported 3D-fractal fabrication process needed additional low pressure chemical vapor deposition (LPCVD) steps of silicon nitride, as well as local oxidation of silicon (LOCOS). Employing this new procedure, a three generation folded silicon oxide fractal sheet with approx. a 10 µm footprint has been fabricated.2016http://zaguan.unizar.es/record/11076910.1109/DTIP.2016.7514895http://zaguan.unizar.es/record/110769oai:zaguan.unizar.es:110769Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (2016), [4 pp.]All rights reservedhttp://www.europeana.eu/rights/rr-f/info:eu-repo/semantics/openAccess