3D-Fractal engineering based on oxide-only corner lithography
Resumen: This paper reports a new highly simplified machining process for three dimensional (3D)-fractal nanofabrication based on oxide-only corner lithography. It consists of a repeated sequence of wet etching (silicon), thermal oxidation and wet etching (silicon oxide). The previously reported 3D-fractal fabrication process needed additional low pressure chemical vapor deposition (LPCVD) steps of silicon nitride, as well as local oxidation of silicon (LOCOS). Employing this new procedure, a three generation folded silicon oxide fractal sheet with approx. a 10 µm footprint has been fabricated.
Idioma: Inglés
DOI: 10.1109/DTIP.2016.7514895
Año: 2016
Publicado en: Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (2016), [4 pp.]
ISSN: 2768-1874

Tipo y forma: Congress (Published version)
Área (Departamento): Área Ingeniería Química (Dpto. Ing.Quím.Tecnol.Med.Amb.)

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