Improved copper–epoxy adhesion by laser micro- and nano-structuring of copper surface for thermal applications

Mora M. (Universidad de Zaragoza) ; Amaveda H. (Universidad de Zaragoza) ; Porta-Velilla L. (Universidad de Zaragoza) ; de la Fuente G.F. ; Martínez E. ; Angurel L.A. (Universidad de Zaragoza)

Resumen: The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryo-genic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.

Idioma: Inglés

DOI: 10.3390/polym13111721

Año: 2021

Publicado en: Polymers 13, 11 (2021), 1721 [14 pp]
ISSN: 2073-4360

Factor impacto JCR: 4.967 (2021)

Categ. JCR: POLYMER SCIENCE rank: 16 / 90 = 0.178 (2021) - Q1 - T1

Factor impacto CITESCORE: 5.7 - Materials Science (Q1)

Factor impacto SCIMAGO: 0.726 - Polymers and Plastics (Q1) - Chemistry (miscellaneous) (Q1)

Financiación: info:eu-repo/grantAgreement/ES/DGA/T54-20R
Financiación: info:eu-repo/grantAgreement/ES/MICIU/ENE2017-83669-C4-1-R

Tipo y forma: Artículo (Versión definitiva)

Área (Departamento): Área Cienc.Mater. Ingen.Metal. (Dpto. Ciencia Tecnol.Mater.Fl.)