| Página principal > Artículos > Improved copper–epoxy adhesion by laser micro- and nano-structuring of copper surface for thermal applications > BibTeX |
@article{Mora:129343,
author = "Mora M. and Amaveda H. and Porta-Velilla L. and de la
Fuente G.F. and Martínez E. and Angurel L.A.",
title = "{Improved copper–epoxy adhesion by laser micro- and
nano-structuring of copper surface for thermal
applications}",
year = "2021",
}