000129343 001__ 129343
000129343 005__ 20231215094309.0
000129343 0247_ $$2doi$$a10.3390/polym13111721
000129343 0248_ $$2sideral$$a126585
000129343 037__ $$aART-2021-126585
000129343 041__ $$aeng
000129343 100__ $$0(orcid)0000-0003-4747-7327$$aMora M.$$uUniversidad de Zaragoza
000129343 245__ $$aImproved copper–epoxy adhesion by laser micro- and nano-structuring of copper surface for thermal applications
000129343 260__ $$c2021
000129343 5060_ $$aAccess copy available to the general public$$fUnrestricted
000129343 5203_ $$aThe objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryo-genic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.
000129343 536__ $$9info:eu-repo/grantAgreement/ES/DGA/T54-20R$$9info:eu-repo/grantAgreement/ES/MICIU/ENE2017-83669-C4-1-R
000129343 540__ $$9info:eu-repo/semantics/openAccess$$aby$$uhttp://creativecommons.org/licenses/by/3.0/es/
000129343 590__ $$a4.967$$b2021
000129343 591__ $$aPOLYMER SCIENCE$$b16 / 90 = 0.178$$c2021$$dQ1$$eT1
000129343 592__ $$a0.726$$b2021
000129343 593__ $$aPolymers and Plastics$$c2021$$dQ1
000129343 593__ $$aChemistry (miscellaneous)$$c2021$$dQ1
000129343 594__ $$a5.7$$b2021
000129343 655_4 $$ainfo:eu-repo/semantics/article$$vinfo:eu-repo/semantics/publishedVersion
000129343 700__ $$0(orcid)0000-0003-2212-447X$$aAmaveda H.$$uUniversidad de Zaragoza
000129343 700__ $$aPorta-Velilla L.$$uUniversidad de Zaragoza
000129343 700__ $$0(orcid)0000-0002-0500-1745$$ade la Fuente G.F.
000129343 700__ $$0(orcid)0000-0003-4839-5286$$aMartínez E.
000129343 700__ $$0(orcid)0000-0001-5685-2366$$aAngurel L.A.$$uUniversidad de Zaragoza
000129343 7102_ $$15001$$2065$$aUniversidad de Zaragoza$$bDpto. Ciencia Tecnol.Mater.Fl.$$cÁrea Cienc.Mater. Ingen.Metal.
000129343 773__ $$g13, 11 (2021), 1721 [14 pp]$$pPolymers (Basel)$$tPolymers$$x2073-4360
000129343 8564_ $$s6860687$$uhttps://zaguan.unizar.es/record/129343/files/texto_completo.pdf$$yVersión publicada
000129343 8564_ $$s2802479$$uhttps://zaguan.unizar.es/record/129343/files/texto_completo.jpg?subformat=icon$$xicon$$yVersión publicada
000129343 909CO $$ooai:zaguan.unizar.es:129343$$particulos$$pdriver
000129343 951__ $$a2023-12-14-13:18:57
000129343 980__ $$aARTICLE