High-level modeling and simulation tool for sensor conditioning circuit based on artificial neural networks
Resumen: For current microelectronic integrated systems, the design methodology involves different steps that end up in the full system simulation by means of electrical and physical models prior to its manufacture. However, the higher the circuit complexity, the more time is required to complete these simulations, jeopardizing the convergence of the numerical methods and, hence, meaning that the reliability of the results are not guaranteed. This paper shows the use of a high-level tool based on Matlab to simulate the operation of an artificial neural network implemented in a mixed analog-digital CMOS process, intended for sensor calibration purposes. The proposed standard tool enables modification of the neural model architecture to adapt its characteristics to those of the electronic system, resulting in accurate behavioral models that predict the complete microelectronic IC system behavior under different operation conditions before its physical implementation with a simple, time-efficient, and reliable solution.
Idioma: Inglés
DOI: 10.3390/s19081814
Año: 2019
Publicado en: Sensors (Switzerland) 19, 8 (2019), [25 pp.]
ISSN: 1424-8220

Factor impacto JCR: 3.275 (2019)
Categ. JCR: CHEMISTRY, ANALYTICAL rank: 22 / 86 = 0.256 (2019) - Q2 - T1
Categ. JCR: INSTRUMENTS & INSTRUMENTATION rank: 15 / 64 = 0.234 (2019) - Q1 - T1
Categ. JCR: ENGINEERING, ELECTRICAL & ELECTRONIC rank: 77 / 266 = 0.289 (2019) - Q2 - T1

Factor impacto SCIMAGO: 0.653 - Instrumentation (Q1) - Atomic and Molecular Physics, and Optics (Q2) - Medicine (miscellaneous) (Q2) - Information Systems (Q2) - Analytical Chemistry (Q2) - Electrical and Electronic Engineering (Q2) - Biochemistry (Q3)

Financiación: info:eu-repo/grantAgreement/ES/MINECO-FEDER/TEC2015-65750-R
Tipo y forma: Article (Published version)
Área (Departamento): Área Electrónica (Dpto. Ingeniería Electrón.Com.)
Exportado de SIDERAL (2020-07-16-09:02:40)


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 Notice créée le 2019-07-09, modifiée le 2020-07-16


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