Resumen: This paper reports a new highly simplified machining process for three dimensional (3D)-fractal nanofabrication based on oxide-only corner lithography. It consists of a repeated sequence of wet etching (silicon), thermal oxidation and wet etching (silicon oxide). The previously reported 3D-fractal fabrication process needed additional low pressure chemical vapor deposition (LPCVD) steps of silicon nitride, as well as local oxidation of silicon (LOCOS). Employing this new procedure, a three generation folded silicon oxide fractal sheet with approx. a 10 µm footprint has been fabricated. Idioma: Inglés DOI: 10.1109/DTIP.2016.7514895 Año: 2016 Publicado en: Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (2016), [4 pp.] ISSN: 2768-1874 Tipo y forma: Comunicación congreso (Versión definitiva) Área (Departamento): Área Ingeniería Química (Dpto. Ing.Quím.Tecnol.Med.Amb.)